Fit More in Less: Enabling The Future of Semiconductor Advanced Packaging and Heterogeneous Integration
ASPDL pioneers an innovative approach to advanced chip packaging design, unlocking the potential of seamless integration and innovation. We offer bespoke, reusable high-density wiring design layouts with novel congestion free routing tailored for advanced packaging and heterogeneous integration. Leveraging our in-house design technology, we generate optimized layouts for any package size, serving as vital foundations for next generation silicon-based computing systems.
